Heat dissipation device including heat sink and heat pipes

ABSTRACT

A heat dissipation device includes a heat sink ( 10 ) and a pair of heat pipes ( 20 ). The heat sink includes a base ( 12 ), a top plate ( 18 ), and a plurality of fins ( 16 ) thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to heat dissipation devices, andmore particularly to a heat dissipation device including a heat sink andheat pipes for achieving great heat dissipation efficiency.

[0003] 2. Description of Prior Art

[0004] During operation of an electronic device such as a computercentral processing unit (CPU), a large amount of heat is often produced.The heat must be quickly removed from the CPU to prevent it frombecoming unstable or being damaged. Typically, a heat sink is attachedto an outer surface of the CPU to absorb heat from the CPU. The heatabsorbed by the heat sink is then dissipated to ambient air.

[0005] Conventionally, a heat sink comprises a solid metal base attachedon the CPU, and a plurality of fins formed from the base. The base isintimately attached on the CPU, and must be adequately cooled to ensurenormal operation of the CPU. Most of the heat accumulated at the base istransferred firstly to the fins and then dissipated from the fins.However, the electronics technology continues to advance, and increasingamounts of heat are being generated by powerful state-of-the-art CPUs.Many conventional heat sinks are no longer able to efficiently removeheat from these CPUs.

[0006] An improved heat dissipation device is desired to overcome theabove-described disadvantages of the prior art.

SUMMARY OF THE INVENTION

[0007] Accordingly, an object of the present invention is to provide aheat dissipation device which can quickly and efficiently transfer heataway from a base of a heat sink thereof.

[0008] In order to achieve the object set out above, a heat dissipationdevice in accordance with a preferred embodiment of the presentinvention comprises a heat sink and a pair of heat pipes. The heat sinkincludes a base, a top plate, and a plurality of fins thermallyconnecting the base and the plate through solder. Opposite ends of eachheat pipe are engaged with the base and the plate respectively, fortransferring heat accumulated at the base to the plate. Other relatedembodiments are also efficacious.

[0009] Other objects, advantages and novel features of the presentinvention will become more apparent from the following detaileddescription when taken in conjunction with the accompanying drawings, inwhich:

BRIEF DESCRIPTION OF THE DRAWINGS

[0010]FIG. 1 is an isometric view of a heat dissipation device inaccordance with the preferred embodiment of the present invention;

[0011]FIG. 2 is an isometric view of a heat dissipation device inaccordance with an alternative embodiment of the present invention;

[0012]FIG. 3 is an isometric view of a heat dissipation device inaccordance with a further alternative embodiment of the presentinvention; and

[0013]FIG. 4 is an isometric view of a heat dissipation device inaccordance with a still further alternative embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

[0014] Referring to FIG. 1, a heat dissipation device in accordance withthe preferred embodiment of the present invention comprises a heat sink10 and a pair of heat pipes 20.

[0015] The heat sink 10 comprises a solid base 12 adapted to be attachedon an electronic package (not shown) and a flat plate 18 separate fromand parallel to the base 12. A plurality of fins 16 extends between thebase 12 and the plate 18. The plurality of fins 16 has opposite rightangled ends 161 thereof soldered with solder such as tin, to the base 12and the plate 18 at opposite ends thereof. Both of the right angled ends161 not only provide sufficient area soldering to the corresponding base12 and plate 18 but also abut against the neighboring fin for mutuallyenhancing rigidity of the neighboring fins. A pair of first holes 14 isdefined in a side of the base 12. A pair of second holes 19 is definedin a corresponding side of the plate 19. Each heat pipe 20 issubstantially U-shaped, and forms a capillary structure therein. Workmedium is contained in the pipe 20. Opposite ends of each heat pipe 20are engaged in a respective first hole 14 and a corresponding secondhole 19.

[0016] In the present invention as illustrated by the above preferredembodiment, some heat accumulated at the base 12 is transferred to thefins 16 through the solder therebetween, while some said heat istransferred to the plate 18 via the heat pipes 20. The heat on the plate18 is then transferred to the fins 16 through the solder therebetween.Thus, the base 12 is rapidly cooled.

[0017] Referring to FIG. 2, in the alternative embodiment of the presentinvention, first holes 14′ are defined in opposite sides of a base 12′of a heat sink 10′, and second holes 19′ are correspondingly defined inopposite sides of a plate 18′. Four heat pipes 20 are engaged in thecorresponding first and second holes 14′, 19′.

[0018] Referring to FIG. 3, in the further alternative embodiment of thepresent invention, a pair of first cutouts 14″ is defined in a side of abase 12″ of a heat sink 10″, and a pair of second cutouts 19″ is definedin a corresponding side of a plate 18″. A pair of heat pipes 20 isengaged in the corresponding first and second cutouts 14″, 19″.

[0019] Referring to FIG. 4, in the still further alternative embodimentof the present invention, first cutouts 14′″ are defined in oppositesides of a base 12′″ of a heat sink 10′″, and second cutouts 19′″ arecorrespondingly defined in opposite sides of a plate 18′″. Four heatpipes 20 are engaged in the corresponding first and second cutouts 14′″,19′″.

[0020] In yet further alternative embodiments of the present invention,the base 12/12′/12″/12′″ maybe hollow and contain work medium therein.

[0021] It is to be understood, however, that even though numerouscharacteristics and advantages of the present invention have been setforth in the foregoing description, together with details of thestructure and function of the invention, the disclosure is illustrativeonly, and changes may be made in detail, especially in matters of shape,size, and arrangement of parts within the principles of the invention tothe fill extent indicated by the broad general meaning of the terms inwhich the appended claims are expressed.

What is claimed is:
 1. A heat dissipation device comprising: a heat sinkcomprising a base and a plate spaced apart from the base, a plurality offins soldered to the base and the plate at opposite ends thereof; and aplurality of heat pipes thermally connecting the base and the plate. 2.The heat dissipation device of claim 1, wherein ports are defined in thebase and the plate respectively, the ports receiving opposite ends ofthe heat pipes.
 3. The heat dissipation device of claim 1, wherein theports are holes.
 4. The heat dissipation device of claim 1, wherein theports are cutouts.
 5. The hat dissipation device of claim 1, wherein theopposite ends of the fins are right angled and abut against theneighboring fins for not only providing sufficient area for soldering toboth said base and plate, but also mutually enhancing rigidity of theneighboring fins.
 6. A heat dissipation device comprising: a heat sinkcomprising a base, a plate spaced apart from the base, and a pluralityof fins thermally connecting the base and the plate through solder; anda plurality of heat pipes engaged between the base and the plate, fortransferring heat from the base to the plate.
 7. The heat dissipationdevice of claim 6, wherein the solder is tin.
 8. The hat dissipationdevice of claim 6, wherein at least one of the opposite ends of the finis right angled and abuts against the neighboring fins, which not onlyprovides sufficient area for soldering to the corresponding plate orbase, but also mutually enhances rigidity of the neighboring fins.
 9. Aheat dissipation device comprising: a heat sink comprising a base, aplate spaced apart from the base, and a plurality of fins locatedbetween said base and said plate and thermally respectively connectingto at least one of the base and the plate through solder; and aplurality of heat pipes engaged between the base and the plate, fortransferring heat from the base to the plate.
 10. The hat dissipationdevice of claim 9, wherein at least one of the opposite ends of each ofthe fins is right angled and abuts against the neighboring fins, whichnot only provides sufficient area for soldering to the correspondingplate or base connected thereto, but also mutually enhances rigidity ofthe neighboring fins.